Professor Rokhyeon Baek from POSTECH’s Department of Electrical Engineering was invited to give a presentation at the IEEE International Electron Device Meeting (IEDM) on December 11, 2024, as part of the Focus session on “Leading Semiconductor Products and Advanced Packaging.” This session is designed around the most prominent topics of the year, selected by the organizing committee, with suitable speakers invited from around the world. Notably, POSTECH was the only academic institution among the speakers, alongside industry giants such as NVIDIA, AMD, Qualcomm, TSMC, Intel, TEL, and IBM.

In his presentation, Professor Baek and his research team provided a roadmap for cutting-edge logic technologies, including Forksheet and Complementary devices, as well as three-dimensional wafer backside technologies, which are applicable to the next-generation angstrom technology nodes beyond the nanoscale. They used quantitative metrics and integrated analysis to present the advancements in these technologies.

The IEDM, celebrating its 70th anniversary this year, is considered one of the most prestigious conferences in the semiconductor device and process fields, alongside the Symposia on VLSI Technology and Circuit. The conference is held annually in early December in San Francisco, USA.